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中科纳通

提供以金属银为核心的导电材料产品和服务。通过高品质的导电浆料、电子胶及纳米膜系列产品和专业检测服务,为客户创造价值。

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导电/屏蔽材料

NT-ST202 is an antenna sliver paste at a low temperature curing. It is non-toxic element up to European RoHS environmental regulation. It is available for antenna printing of various communication devices, mobile phones and other terminal products, and can be processed by screen printing, transfer printing, spraying and other methods. This product uses high-strength resin as the connecting phase, ultra-fine silver powder and flake powder as the conductive phase, which effectively improves the wear resistance and weatherability of the printed circuit, and has low resistance and good low-temperature curing performance. It can be applied to plastics, ceramics, glass and other substrates.
NT-ST70D is an environmentally conductive sliver paste. It is non-toxic element up to European RoHS environmental regulation. It has good printability, perfect pad printing, low impedance, low curing temperature and high great adhesion. It can be high speed continuous printing /pad printing/ gravure coating on different substrates such as PET, Copperplate paper, Teslin, phone case and other substrates. It has excellent bending, which apply to RFID, Electronic label, Ticket card.
NT-ST203 is a nickel carbon conductive paste, which is applied to the electromagnetic shielding sealed equipment. The fast drying nickel paste forms a thin, conductive and flexible layer with good adhesion on most substrates.
NT-ST201 is the best conductive past to electromagnetic shielding and pressurized equipment. In addition to its excellent conductivity and adhesion, it also has a unique tensile property, attaining the tensile ratio of up to 200%, with good resistance and adhesion.
NT-Ink135S is a nano-conductive silver paste, which is specially designed for the gravure printing,pad printing and metal mesh technique. It can be well applied to metal mesh technique.
NT-ST80B is the best printing silver paste for flexible circuit with ROHS standard, which is appropriate in varieties of flexible circuit printing production for wearable devices. It is designed on the resin with high flexibility as the connection phase and ultrafine silver powder mixed with flake powder as conductive phase; hence it greatly improves bending resistance and conductivity of the printed circuit.
NT-SL2011系列是一款纯银弹性体硅橡胶,是一款良好的电磁兼容、屏蔽产品。可根据客户的产品截面和密封圈周长尺寸订制,并根据客户要求对产品进行贴背胶及接口部位焊接粘合,可解决智能电子设备在复杂且恶劣的电磁干扰运行环境下的可靠性问题,为客户提供环境评估失效性能及个性化应对措施和全面解决方案,具有优异的稳定性能,集中应用在通讯设备、航空航天、医疗、电子、机械制造、轨道交通、新能源等行业。
NT-SL2031系列是一款镍碳弹性体硅橡胶,是一款良好的电磁兼容、屏蔽产品。可根据客户的产品截面和密封圈周长尺寸订制,并根据客户要求对产品进行贴背胶及接口部位焊接粘合,可解决智能电子设备在复杂且恶劣的电磁干扰运行环境下的可靠性问题,为客户提供环境评估失效性能及个性化应对措施和全面解决方案,具有优异的稳定性能,集中应用在通讯设备、航空航天、医疗、电子、机械制造、轨道交通、新能源等行业。
NT-ST70D是一款符合RoHS标准的导电银浆,具有良好印刷性、移印性、低阻抗、低固化温度、高附着力等性能。在PET、铜版纸、Teslin、手机外壳等多种基材上可满足高速连续印刷/移印/凹版涂布使用,具有良好的弯折性能。适于RFID、柔性导电线路等多个领域。
NT-ST202是一款符合RoHS标准的低温固化天线银浆,适用于多种通讯器件,手机等终端产品的天线印刷,可采用丝印、转印、喷涂等多种方式进行加工制作。本产品采用高强的树脂作为连接相,超细银粉与片粉混合作为导电相,有效的提高了印刷线路的耐磨性与耐候性能,同时低电阻值与良好的低温固化性能,可以适用于各种塑胶、陶瓷、玻璃等基材 。
NT-NP04系列是一款低温固化的导电镍碳胶,其具有良好的电磁兼容、屏蔽效果。可根据客户编程图形,完成复杂图形的点胶施工方案,解决智能电子设备在复杂且恶劣的电磁干扰运行环境下的可靠性问题,为客户提供评估失效性能及个性化应对措施和全面解决方案,具有优异的稳定性能,集中应用在通讯设备、航空航天、医疗、电子、机械制造、轨道交通、新能源等行业。
NT-SL2012系列是一款银铝弹性体硅橡胶,是一款良好的电磁兼容、屏蔽产品。可根据客户的产品截面和密封圈周长尺寸订制,并根据客户要求对产品进行贴背胶及接口部位焊接粘合,可解决智能电子设备在复杂且恶劣的电磁干扰运行环境下的可靠性问题,为客户提供环境评估失效性能及个性化应对措施和全面解决方案,具有优异的稳定性能,集中应用在通讯设备、航空航天、医疗、电子、机械制造、轨道交通、新能源等行业。
NanoTopNT-ST203 1. 产品概要  NT-ST203系列是一款专门适用于电磁屏蔽密封设备上的导电镍碳浆,其性能除了优良的导电性与附着力之外,还具有独特的可拉伸性,拉伸200%以内,电阻与附着力均能保持良好。 2. 特性 (1)浆料具有良好的耐弯折性能与独特的可拉伸性能;(2)与硅胶等基材附着力优异;(3)固化后膜层致密,表面导电性好和耐磨损,良好的耐候性。 3. 性能参数 主要指标测
NanoTop NT-ST201  1. 产品概要NT-ST201系列是一款专门适用于电磁屏蔽密封设备上的导电银浆,其性能除了优良的导电性与附着力之外,还具有独特的可拉伸性,拉伸200%以内,电阻与附着力均能保持良好。 2. 特性(1)浆料具有良好的耐弯折性能与独特的可拉伸性能;(2)与硅胶等基材附着力优异;(3)固化后膜层致密,表面导电性好,耐磨损,良好的耐候性。 3. 性能参数 主要指标测试方
产品描述中科纳通NT-ink-135S产品提供以下产品特性技术高分子改性聚酯树脂体系外观银灰色填料类型银  产品优势●单组份●可固化●快速固化●优异的韧性●附着力好●低阻抗●接触电阻低固化方式热固化应用金属网格技术应用表面贵金属操作温度-45至125℃中科纳通NT-ink-135S是一种纳米导电银浆,专为金属网格技术应用而设计。具有优良的填充性、触变性、导电性与耐溶剂性。 材料未固化状态典型特征粘