EN 低温固化银浆NT-TL50B

NT-TL50B is a low temperature (≤80℃ curing) and general purpose conductive sliver paste. It is non-toxic element up to European RoHS environmental regulation. It has excellent fine patterning with laser etching and high printing adaptability. The very thin wire (60µm/60µm) can be printed by screen, and Laser process can be etched to 30µm or above line. The adhesion to some substrate arrives at above 5B, such as ITO, metal (Cu, Ag and Al), Si chip, PEEK, PI, PET and nano-Ag film.

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低温固化银浆

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    • 商品名称: EN 低温固化银浆NT-TL50B
    • 商品编号: 1214868940647976960

    NT-TL50B is a low temperature (≤80℃ curing) and general purpose conductive sliver paste. It is non-toxic element up to European RoHS environmental regulation. It has excellent fine patterning with laser etching and high printing adaptability. The very thin wire (60µm/60µm) can be printed by screen, and Laser process can be etched to 30µm or above line. The adhesion to some substrate arrives at above 5B, such as ITO, metal (Cu, Ag and Al), Si chip, PEEK, PI, PET and nano-Ag film.

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